RESUME

Kun Zhao

Address:

Earl Mountbatten Building, Room 3.17
Electrical, Electronic and Computer Engineering
School of Engineering & Physical Sciences
Heriot-Watt University
Edinburgh EH14 4AS
Tel (+44) 0131 451 8275
Fax (+44) 0131 451 4155

EDUCATION BACKGROUND

07/2007—now Heriot-Watt University - School of EPS

Major: Electrical Engineering

Degree: Ph.D (in progress)

Honors: Overseas Research Students Award

08/2004—06/2007 Shanghai University

Major: Mechanical Engineering

Degree: M.Phil

Honors: 2006 Shanghai LED R&D Centre Outstanding Individual Award

2006 Shanghai University Guanghua First-class Scholarship

2006 Toyo-Denso Postgraduate Scholarship

2005 Toyo-Denso Postgraduate Scholarship

08/2000—07/2004 Dalian Jiaotong University

Major: Material Science and Engineering

Degree: B.Sc

Honors: University Scholarships for 3 consecutive years

A-list student

RESEARCH EXPERIENCE

07/2007—now

Unit: School of Engineering and Physics, Heriot-Watt University

Project: Investigation of polymer bonding processes for MEMS packaging

08/2004—06/2007

Unit: Key Laboratory of Advanced Display and System Application (Shanghai University), Ministry of Education & School of Mechatronics Engineering and Automation, Shanghai University

Participant projects:

1) Study on the micro-fabrication of thermosonic bonding for high brightness/high power solid state lighting device (LED) (National Nature Science Fundation of China, No. 50675130)

2) Study of nano polishing liquid industrialization technology and CMP process (Science and Technology Committee of Shanghai, No.05nm05043)

3) Shanghai Shuguang Programme: Study on the thermosonic flip chip micrl-fabrication of high brightness light emitting diode

02/2004—06/2004

Unit: School of Material Science and Engineering, Dalian Jiaotong University

Project: Flat Copper Wire Hardening Equipment Design

PUBLICATIONS

Kun Zhao, Chunya Li, Jianhua Zhang, Electronic Paper Display Technology. Asia Display’2007(AD’07), 12-16 March, 2007, Shanghai, China
Kun Zhao, Lei Jia, Ji’an Duan, Jianhua Zhang, Effects of Thermosonic Bonding Parameters on Flip Chip LEDs. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. pp.297-303
Kun Zhao, Jianhua Zhang, Ji’an Duan, Effects of Bonding Parameters on the Lighting Performance of High Power LEDs Fabricated by Thermosonic Flip Chip Bonding. 2006 7th International Conference on Electronics Packaging Technology. pp.851-855
S H Su, K Zhao, S W Ma, J H Zhang, Simulation Study of bump metallization on the stress and strain distributions of ACF interconnections for flip-chip-on-flex(COF) applications. 2005 6th International Conference on Electronics Packaging Technology. pp.437-440
Kun Zhao, Shiwei Ma, Shihu Su, Jianhua Zhang, Packaging Issues on Combination of LED and Flip Chip. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. pp.294-298
Kun Zhao, Jianhua Zhang, Advanced Packaging Technology for High Power LEDs. 2006 International Forum on Electronic Interconnecting Technology and Materials. (Invited talk) 17-18 November 2006, Shanghai, China.

WORKING EXPERIENCE

07/2005—07/2006

Unit: Shanghai Rainbow Opto-electronic Materials Company

Work: Intern engineer in department of flip chip light emitting diodes (LEDs) manufacture

03/2005—06/2005

Unit: Sino-Swedish Microsystem Integration Technology Center, Shanghai University

Work: Organizing committee member of 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP’05)

09/2004—12/2004

Unit: GLMBA Centre, Shanghai University

Work: Administration assistant in the Department of Resource Development

PERSONAL INFORMATION

Hometown: Kaifeng, He’nan Province

Nationality: People’s Republic of China

Hobbies: Traveling, Basketball, Table tennis, Badminton, Music and Reading