Yufei LIU, BSc, MSc, MIET.
Yufei LIU received his BSc degree in Physics from School of Physics and BA degree in Economics from China Center for Economic Research (CCER), Peking University, Beijing, China, in 2003, respectively, and received the MSc degree in Electronic Engineering from Chinese Academy of Sciences (CAS), Shanghai, China, in 2006.
Low temperature hermetic packaging technology
The fabrication processes for the integration of System-in-Package (SiP)
Project A: Laser Assisted Polymer Bonding for MEMS Packaging
Project B: IeMRC Project "I-Health" Integrated Health Monitoring of SiP based Microsystems
supported by Engineering and Physical Sciences Research Council (EPSRC), UK.
Professional Activities and Internships
Internship in Semiconductor Equipment and Material International (SEMI), Shanghai, China, May 2006-Dec. 2006.
Postgraduate Representative for Dept. of EECE (Student-Staff Council), 2007-2008.
Tutorial: Term 1, 2007-2008. Module Code: B31PX. Lecturer: Prof. Andrew M Wallace.
Postgraduate Representative for Dept. of EECE (Student-Staff Council), 2008-2009.
Tutorial: Term 1, 2008-2009. Module Code: B31PX. Lecturer: Dr. Changhai Wang.
Tutorial: Term 1, 2008-2009. Module Code: B49CB. Lecturer: Dr. Robin E.Westacott.
1. Yufei Liu, Jun Zeng, and Changhai Wang, "In-Situ Temperature Monitoring for Process Control in Laser Assisted Polymer Bonding for MEMS Packaging " IEEE Proc. of Electronics Systemintegration Technology Conference (ESTC 2008), London, UK, pp. 199-203.
First Year Postgraduate Research Prize,
Engineering & Physical Sciences,
Heriot Watt University, Oct. 2007. (Top 3)
Presidential Scholarship of Shanghai Institute of Microsystem and Information Technology (SIMIT), 2006. (Top 2%)
Excellent Student of Chinese Academy of Sciences (CAS), 2006. (Top 5%)
Excellent graduate of Peking University, 2003. (Top 5%)
Freshman Scholarship of Peking University, 1999.
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This page was last modified on 09 Dec. 2008.